Performance Evaluation of Developed Transient Thermal Measurement System for Power Semiconductor Packages with Low Thermal Resistance

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Publication Details

Journal
Journal of The Japan Institute of Electronics Packaging
Published
2025-10-15
DOI
https://doi.org/10.5104/jiep.jiep-d-25-00058
Primary Topic
Electronic Packaging and Soldering Technologies
Type
article
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article

Performance Evaluation of Developed Transient Thermal Measurement System for Power Semiconductor Packages with Low Thermal Resistance

Shuhei Fukunaga, Tsuyoshi Funaki
Journal of The Japan Institute of Electronics Packaging
Electronic Packaging and Soldering Technologies
article

Performance Evaluation of Developed Transient Thermal Measurement System for Power Semiconductor Packages with Low Thermal Resistance

Shuhei Fukunaga, Tsuyoshi Funaki
article en

Abstract

No abstract available for this paper.
Journal of The Japan Institute of Electronics PackagingVol. 29(1)
The University of Osaka (JP)
Openalex Percentile: Top 71%
Electronic Packaging and Soldering Technologies
DOISourceOpenAlex
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Performance Evaluation of Developed Transient Thermal Measurement System for Power Semiconductor Packages with Low Thermal Resistance — Shuhei Fukunaga, Tsuyoshi Funaki · Journal of The Japan Institute of Electronics Packaging (2025) | TGRS Research Map | TGRS