Three‐dimensional printing of micro‐column BaTiO <sub>3</sub> ceramics and their applications in 1–3 piezoelectric composite transducer

Abstract The photopolymerization‐based three‐dimensional (3D) printing technique overcomes the limitations associated with complex geometries and significantly reduces manufacturing time, making it increasingly suitable for fabricating micro‐scale materials. This study evaluates the influence of printing parameters on the microstructure and electrical properties of piezoelectric ceramics by fabricating BaTiO 3 (BT) ceramics with varying solid contents (34–47 vol%) and printing layer thicknesses (5–40 µm) using photopolymerization. The printed BT ceramic exhibits favorable electrical properties ( d 33 ∼255 pC/N, ε r ∼1681, tan δ∼0.013) when the solid content is 40 vol% and the layer thickness is 10 µm. In addition, micro‐columns with a width of 150 µm are successfully printed and integrated into a high‐performance 1–3 composite ultrasonic transducer, achieving a center frequency of 13.5 MHz and a ‐6 dB bandwidth of 52%. These results indicated that optimizing the solid content and printing layer thickness is essential for producing ceramics with superior performance. Photopolymerization‐based 3D printing presents strong potential for fabricating complex structures and highly precise piezoelectric composites.

Authors

Institutions

Publication Details

Journal
Journal of the American Ceramic Society
Published
2025-10-15
DOI
https://doi.org/10.1111/jace.70306
Primary Topic
Additive Manufacturing and 3D Printing Technologies
Type
article
Field-Weighted Citation Impact
0.00
Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

Three‐dimensional printing of micro‐column BaTiO 3 ceramics and their applications in 1–3 piezoelectric composite transducer

Xuanrong Ji, Lvming Zeng, L. F. Chen, Zipeng Wu et al.
Journal of the American Ceramic Society
Additive Manufacturing and 3D Printing Technologies
article

Three‐dimensional printing of micro‐column BaTiO 3 ceramics and their applications in 1–3 piezoelectric composite transducer

Xuanrong Ji, Lvming Zeng, L. F. Chen, Zipeng Wu, Yan Chen, Junwei Wu
article en

Abstract

Abstract The photopolymerization‐based three‐dimensional (3D) printing technique overcomes the limitations associated with complex geometries and significantly reduces manufacturing time, making it increasingly suitable for fabricating micro‐scale materials. This study evaluates the influence of printing parameters on the microstructure and electrical properties of piezoelectric ceramics by fabricating BaTiO 3 (BT) ceramics with varying solid contents (34–47 vol%) and printing layer thicknesses (5–40 µm) using photopolymerization. The printed BT ceramic exhibits favorable electrical properties ( d 33 ∼255 pC/N, ε r ∼1681, tan δ∼0.013) when the solid content is 40 vol% and the layer thickness is 10 µm. In addition, micro‐columns with a width of 150 µm are successfully printed and integrated into a high‐performance 1–3 composite ultrasonic transducer, achieving a center frequency of 13.5 MHz and a ‐6 dB bandwidth of 52%. These results indicated that optimizing the solid content and printing layer thickness is essential for producing ceramics with superior performance. Photopolymerization‐based 3D printing presents strong potential for fabricating complex structures and highly precise piezoelectric composites.

Journal of the American Ceramic SocietyVol. 109(1)
Guangdong University of Technology (CN)
Openalex Percentile: Top 68%
Additive Manufacturing and 3D Printing Technologies
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.