Online Threshold Voltage Monitoring for Silicon Carbide Planar and Trench MOSFETs under γ-Ray Exposure
Traditional threshold-voltage ( V th ) measurements are usually performed either offline or during in situ state monitoring, are typically conducted offline or in situ state monitoring, limiting their ability to assess V th accurately during the aging process. This paper proposes an online method to monitor the V th of silicon carbide (SiC) metal oxide semiconductor field effect transistors (MOSFETs) within the space environment characterized by high-energy ionizing radiation. After observing the V th degradation during the experimental procedure, we simulated the total ionizing dose (TID)-induced degradation to validate the sampled V th of our experiment. The study also predicts V th degradation trends by analyzing the mechanisms of TID-induced degradation. A comprehensive 5-h TID experiment was performed using monitoring methods on a γ-ray plane at a dose rate of 50 rad(Si)/s, provided by a Co-60 source. V th measurements for planar MOSFETs and trench MOSFETs were collected every 15 min with a sampling accuracy of 0.1 V. The monitoring results aligned closely with the predicted trends. To further verify the efficacy of the monitoring technology, technology computer-aided design (TCAD) simulations were conducted to assess the V th sensitivity to TID. The proposed monitoring technology offers adjustable sampling accuracy and frequency, high precision, and a broad sampling range, making it suitable for most reliability test online monitoring applications. This method provides valuable insights for predicting the end-of-life and ensuring the space reliability of SiC MOSFETs.
Authors
- Xinlan Hou
- A. E. Chernyakov (ORCID: https://orcid.org/0000-0002-8153-9512)
- T. Luo (ORCID: https://orcid.org/0000-0001-5139-5784)
- Xiaoyan Xu (ORCID: https://orcid.org/0000-0001-7950-6706)
- Zaiman Xiang
- Runding Luo (ORCID: https://orcid.org/0009-0003-0101-9387)
- Jianjun Zhuang (ORCID: https://orcid.org/0009-0007-1917-4915)
Institutions
- University of Shanghai for Science and Technology (CN)
- Shanghai University of Electric Power (CN)
- Fudan University (CN)
- Submicron Heterostructures for Microelectronics Research and Engineering Center (RU)
- Changzhou University (CN)
- United Microelectronics (United States) (US)
- Beihang University (CN)
Publication Details
- Journal
- Space Science & Technology
- Published
- 2025-10-14
- DOI
- https://doi.org/10.34133/space.0353
- Citations
- 1
- Primary Topic
- Integrated Circuits and Semiconductor Failure Analysis
- Type
- article
- Field-Weighted Citation Impact
- 0.73