Uncertainty Quantification for Compressible Micro-Interconnects in Replaceable Integrated Chiplet Assembly Under Hypergravity

Abstract The compressible micro-interconnects (CMIs) in replaceable integrated chiplet (PINCH) assemblies enable reusable integration in high-performance electronic devices. However, CMIs are sensitive to gravitational and inertial perturbations in the operating environment. To quantify the uncertainty impacts of hypergravity, the deformation of CMIs is analyzed using a finite element model (FEM) and the probability density distribution derived from a large database of stochastic finite element models (SFEM). Hypergravity is found to be a more dominant factor influencing the deformation of CMIs than pressure or shear stress. The displacements in the x and z directions show significant symmetry breaking, highlighting the orientational impact of hypergravity on CMIs' deformation. The broadening effects of mixed inertia are more complex, with a skewed log-normal probability density distribution for the maximum von Mises stress in CMIs. The proposed SFEM framework provides an effective tool for analyzing mechanical reliability and optimizing CMI parameters.