Monte Carlo analysis of hot electron injection in the passivation layer of GaN HEMTs

We investigate the injection of hot electrons in the passivation layer above the drift region of GaN HEMTs by means of Monte-Carlo transport simulations. We find that the lateral component of the electric field in the AlGaN layer delivers a non-negligible kinetic energy to the electrons, thus enhancing injection in the passivation at the top, an effect that is not captured by the standard hot-carrier injection models developed for Si devices that requires the development of ad-hoc hot-carrier injection models for GaN devices. The implications of our calculations for the understanding of reliability and dynamic- R o n are also briefly discussed. • Monte Carlo simulations of hot-electrons in the drift region of GaN HEMTs for power applications. • Increasing the AlGaN thickness reduces hot electron injection but causes additional electron heating. • Passivation engineering is a more efficient strategy to contain hot-electron effects than just increasing the barrier thickness.

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Publication Details

Journal
Solid-State Electronics
Published
2025-10-10
DOI
https://doi.org/10.1016/j.sse.2025.109257
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
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article

Monte Carlo analysis of hot electron injection in the passivation layer of GaN HEMTs

L. Selmi, Pierpaolo Palestri, Andrea Minetto, Oliver D. Häberlen et al.
Solid-State Electronics
GaN-based semiconductor devices and materials
article

Monte Carlo analysis of hot electron injection in the passivation layer of GaN HEMTs

L. Selmi, Pierpaolo Palestri, Andrea Minetto, Oliver D. Häberlen, Luca Sayadi, G. Prechtl
article en

Abstract

We investigate the injection of hot electrons in the passivation layer above the drift region of GaN HEMTs by means of Monte-Carlo transport simulations. We find that the lateral component of the electric field in the AlGaN layer delivers a non-negligible kinetic energy to the electrons, thus enhancing injection in the passivation at the top, an effect that is not captured by the standard hot-carrier injection models developed for Si devices that requires the development of ad-hoc hot-carrier injection models for GaN devices. The implications of our calculations for the understanding of reliability and dynamic- R o n are also briefly discussed. • Monte Carlo simulations of hot-electrons in the drift region of GaN HEMTs for power applications. • Increasing the AlGaN thickness reduces hot electron injection but causes additional electron heating. • Passivation engineering is a more efficient strategy to contain hot-electron effects than just increasing the barrier thickness.

Solid-State ElectronicsVol. 230
University of Modena and Reggio Emilia (IT), Infineon Technologies (Austria) (AT), Infineon Technologies (United States) (US)
Openalex Percentile: Top 82%
GaN-based semiconductor devices and materials
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