Implantable magnetoelectric bioelectronics for wireless diagnosis and therapy

Real-time, high-fidelity physiological signal acquisition, coupled with targeted in situ interventional regulation, is a prerequisite for intelligent health management. Implantable bioelectronics offers a compelling solution for the wireless diagnosis and treatment of subcutaneous organs, circumventing limitations associated with skin-mounted devices. Magnetoelectric bioelectronics (MEBs), an emerging wireless technology, presents advantages in terms of frequency control, transmission efficiency, penetration depth, and interventional safety, holding significant promise for personalized implantable health management. This review comprehensively analyzes the current landscape of MEBs, exploring recent research breakthroughs and their potential impact. We begin by tracing the historical evolution of ME materials, delineating the key factors governing their performance, including the selection and properties of piezoelectric and magnetostrictive materials and their underlying coupling mechanisms. This review then categorizes MEBs according to their connectivity architectures: core–shell, 2-2, and 0-3. Subsequently, we highlight the latest research on implantable MEBs, emphasizing their roles in energy harvesting, signal detection, and disease therapy, specifically contextualized within their respective application domains. Finally, future trends are projected to address the challenges and opportunities surrounding the development of emerging multifunctional MEBs for next-generation health management systems. • This review systematically examines material fundamentals and coupling mechanisms in magnetoelectric bioelectronics. • A structure-property-application framework links core–shell, 2–2, and 0–3 architectures to specific biomedical applications. • Magnetoelectric bioelectronics demonstrate capabilities for wireless energy harvesting, high-sensitivity biosensing, and targeted electrotherapy. • Critical challenges with respect to safety and stability, ME performance, flexibility, miniaturization and portability, and application-specific improvements are discussed.