Proton Irradiation on Hydrogenated Amorphous Silicon Flexible Devices

Radiation damage tests in hydrogenated amorphous silicon (a-Si:H) flexible flux and dose-measuring devices have been performed with a 3 MeV proton beam, to evaluate combined displacement and total ionizing dose damage. The tested devices had two different configurations and thicknesses. The first device was a 2 μm thick n-i-p diode having a 5 mm x 5 mm area. The second device was a 5 μm thick charge selective contact detector having the same area. Both the devices were deposited on a flexible polyimide substrate and were irradiated up to the fluence of 10<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">16</sup> n<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">eq</sub>/cm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup>. The response to different proton fluxes has been measured before irradiation and after irradiation at 10<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">16</sup> n<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">eq</sub>/cm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> for charge-selective contacts and n-i-p devices. The effect of annealing for partial performance recovery at 100°C for 12 hours was also studied and a final characterization on annealed devices was performed. This test is the first combined displacement and total ionizing dose test on flexible a-Si:H devices.

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Journal
IEEE Transactions on Nuclear Science
Published
2025-10-09
DOI
https://doi.org/10.1109/tns.2025.3619653
Primary Topic
Thin-Film Transistor Technologies
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article
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article

Proton Irradiation on Hydrogenated Amorphous Silicon Flexible Devices

L. Servoli, Mariacristina Guarrera, Anna Grazia Monteduro, M. Bizzarri et al.
IEEE Transactions on Nuclear Science
Thin-Film Transistor Technologies
article

Proton Irradiation on Hydrogenated Amorphous Silicon Flexible Devices

L. Servoli, Mariacristina Guarrera, Anna Grazia Monteduro, M. Bizzarri, D. Calvo, N. Zema, K. Kanxheri, Monica Setia Vasquez Mora, S. Pallotta, Giada Petringa, Lucio Maruccio, Anna Paola Caricato, D. Passeri, C. Talamonti, Saba Aziz, A. Morozzi, Matteo Polo, L. Frontini, Michele Fabi, Jonathan Thomet, M. Pedio, A. Stabile, G. de Cesare, Lucio Calcagnile, C. Grimani, M. Cazzanelli, Roberto Catalano, D. Caputo, T. Croci, N. Wyrsch, P. Placidi, G.A.P. Cirrone, Nicola Lovecchio, A. Nascetti, Silvia Rizzato, Marco Petasecca, Federico Sabbatini, Francesca Lenta, M. Menichelli, P. De Remigis, Gianluca Quarta, A. Quaranta, R. Cirio, G. Cuttone, G. Mazza, Mattia Villani, Giuseppe Maruccio, Luca Tosti, Clarissa Buti, Matthew Large, Aishah Bashiri, Maria Ionica, Valentino Liberali, Hamza Hasnaoui, Richard Wheadon, Andrea Papi, Maurizio de Martino, Francesca Peverini, Sylvain Dunand, M. Caprai, Federico Cittadini
article en

Abstract

Radiation damage tests in hydrogenated amorphous silicon (a-Si:H) flexible flux and dose-measuring devices have been performed with a 3 MeV proton beam, to evaluate combined displacement and total ionizing dose damage. The tested devices had two different configurations and thicknesses. The first device was a 2 μm thick n-i-p diode having a 5 mm x 5 mm area. The second device was a 5 μm thick charge selective contact detector having the same area. Both the devices were deposited on a flexible polyimide substrate and were irradiated up to the fluence of 10<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">16</sup> n<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">eq</sub>/cm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup>. The response to different proton fluxes has been measured before irradiation and after irradiation at 10<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">16</sup> n<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">eq</sub>/cm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> for charge-selective contacts and n-i-p devices. The effect of annealing for partial performance recovery at 100°C for 12 hours was also studied and a final characterization on annealed devices was performed. This test is the first combined displacement and total ionizing dose test on flexible a-Si:H devices.

IEEE Transactions on Nuclear ScienceVol. 72(12)
University of Padua (IT), Istituto Nazionale di Fisica Nucleare (IT), Politecnico di Torino (IT), University of Milan (IT), University of Urbino (IT), University of Trento (IT), University of Wollongong (AU), University of Perugia (IT), Istituto Nazionale di Fisica Nucleare, Sezione di Roma Tre (IT), Istituto Nazionale di Fisica Nucleare, Sezione di Lecce (IT), Istituto Nazionale di Fisica Nucleare, Sezione di Torino (IT), Istituto Officina dei Materiali (IT), Institute of Structure of Matter (IT), Istituto Nazionale di Fisica Nucleare, Laboratori Nazionali del Sud (IT), Istituto Nazionale di Fisica Nucleare, Sezione di Firenze (IT), Istituto Nazionale di Fisica Nucleare, Sezione di Milano (IT), Istituto Nazionale di Fisica Nucleare, Sezione di Perugia (IT), University of Florence (IT), Najran University (SA), École Polytechnique Fédérale de Lausanne (CH)
Openalex Percentile: Top 72%
Thin-Film Transistor Technologies
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