Design and Fabrication of CMOS-Based Thermoelectric Microgenerators With Enhanced Power Factor

This study focuses on the design and manufacturing of a thermoelectric microgenerator (TEMG) utilizing complementary metal oxide semiconductor (CMOS)-microelectromechanical system (MEMS) technology. The TEMG features an innovative design with suspended hot-end thermocouples, created through a post-processing. This structural innovation enhances the temperature gradient across the thermocouples, leading to a substantial improvement in power factor of the TEMG. fabricated utilizing the standard CMOS process, the TEMG incorporates p-polysilicon and n-polysilicon thermocouples, ensuring precise fabrication and compact integration. Experimental results reveal that the voltage and power factors are 6.14 mV/mm²K and 0.61 nW/mm²K², respectively. The TEMG delivers a high power factor, making it a potential for applications in self-powered sensors.

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Publication Details

Journal
IEEE Sensors Journal
Published
2025-10-09
DOI
https://doi.org/10.1109/jsen.2025.3617533
Citations
1
Primary Topic
Advanced Thermoelectric Materials and Devices
Type
article
Field-Weighted Citation Impact
0.52
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article

Design and Fabrication of CMOS-Based Thermoelectric Microgenerators With Enhanced Power Factor

Ching‐Liang Dai, Takahito Ono, Wen Li, Cheng-Chih Hsu
1 citations
IEEE Sensors Journal
Advanced Thermoelectric Materials and Devices
0.52
article

Design and Fabrication of CMOS-Based Thermoelectric Microgenerators With Enhanced Power Factor

Ching‐Liang Dai, Takahito Ono, Wen Li, Cheng-Chih Hsu
article en
1 citations

Abstract

This study focuses on the design and manufacturing of a thermoelectric microgenerator (TEMG) utilizing complementary metal oxide semiconductor (CMOS)-microelectromechanical system (MEMS) technology. The TEMG features an innovative design with suspended hot-end thermocouples, created through a post-processing. This structural innovation enhances the temperature gradient across the thermocouples, leading to a substantial improvement in power factor of the TEMG. fabricated utilizing the standard CMOS process, the TEMG incorporates p-polysilicon and n-polysilicon thermocouples, ensuring precise fabrication and compact integration. Experimental results reveal that the voltage and power factors are 6.14 mV/mm²K and 0.61 nW/mm²K², respectively. The TEMG delivers a high power factor, making it a potential for applications in self-powered sensors.

IEEE Sensors JournalVol. 25(22)
National United University (TW), National Chung Hsing University (TW), Tohoku University (JP), Taiwan Semiconductor Manufacturing Company (Taiwan) (TW)
Openalex Percentile: Top 32%
Advanced Thermoelectric Materials and Devices
0.52
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