Ultra-Fast Hyperelastic Conformal Transfer Printing of Curved Surface Electronics on Multi-Curvature Substrates with High Geometric Precision

Three-dimensional (3D) curved surface electronics represent a critical advancement in microelectronics, offering extensive applications across various domains including conformal antennas, curved displays, metasurfaces, and related areas. For the manufacturing methods of curved surface electronics, the direct printing technology on curved surfaces is inefficient, while the transfer printing technology is applied to planar or curved surfaces with a certain curvature. Herein, the authors propose the hyperelastic conformal transfer printing (HCTP) method, which can achieve ultrafast conformal fabrication of curved surface electronics on multicurvature substrates with high geometric precision under the guidance of an area-preserving conformal mapping algorithm. By using HCTP, spiral circuits are fabricated on the hemispherical convex surface, the saddle-shaped concave surface, the uneven wavy surface, and the sharp edge surface respectively; meanwhile, a petal-shaped array circuit is successfully produced on the spherical surface with the central angle exceeding 150°. The conformal area deviation rate of the curved surface circuits is under 1%, and the time required to complete a single curved surface transfer printing process is less than 10 s. Additionally, the hemispherical frequency selective surface (FSS) is efficiently and rapidly fabricated using HCTP, offering an approach for the conformal fabrication of metasurfaces on nondevelopable surfaces.