Simulation Studies to Compare Innovative Cellulose-Based Fibers Composites Printed Circuit Border with Glass Fibres

Electronic equipment is exposed to rough vibrations throughout its life cycle. Electronic components can be damaged by these vibrations and could lead to device failure. The conventional Printed Circuit Boards (PCBs) that form the foundation of numerous electronic devices are predominantly constructed from copper films that are bound to fiber epoxy laminates, such as FR4, which is composed of glass fibers, and FR1, which is composed of paper. Being biodegradable makes cellulose a more sustainable choice. Nonetheless, it is imperative to uphold performance criteria, and this work aims to contribute to this assessment. Using simulation studies, we compare the behavior of these two PCBs under vibrational stress. The finite element analysis (FEA) of the vibrations for the PCB samples was modelled using the Ansys software. The FEA simulations show that both types of PCBs have similar movements and accelerations at certain places on the board.