Automation of Electron Channeling Contrast Imaging: Investigation of Dislocations in AlGaN/GaN Heterostructures

Abstract The investigation and understanding of dislocations in semiconductors are essential for the development of semiconductor devices, in particular for AlGaN/GaN high electron mobility transistors (HEMTs). Based on Scanning Electron Microscopy (SEM), the technique of Electron Channeling Contrast Imaging (ECCI) offers a direct visualization of crystalline defects such as dislocations in bulk specimens and especially in the GaN crystal as well as a way to classify their type. This work widens the scan area of this method from a few square micrometers to the wafer dimensions thanks to a fully automated scan process, achieving valuable statistics for fabrication improvement.

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Publication Details

Journal
Proceedings - International Symposium for Testing and Failure Analysis
Published
2025-11-07
DOI
https://doi.org/10.31399/asm.cp.istfa2025p0417
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
0.00

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article

Automation of Electron Channeling Contrast Imaging: Investigation of Dislocations in AlGaN/GaN Heterostructures

Alexander Hofer, N. Killat, Karen Geens, Alexander Roch et al.
Proceedings - International Symposium for Testing and Failure Analysis
GaN-based semiconductor devices and materials
article

Automation of Electron Channeling Contrast Imaging: Investigation of Dislocations in AlGaN/GaN Heterostructures

Alexander Hofer, N. Killat, Karen Geens, Alexander Roch, Antoine Guitton, Frank Siegelin, Christian Hollerith, Jawad Hadid, C. M. Chisholm, Matthias Gramich
article en

Abstract

Abstract The investigation and understanding of dislocations in semiconductors are essential for the development of semiconductor devices, in particular for AlGaN/GaN high electron mobility transistors (HEMTs). Based on Scanning Electron Microscopy (SEM), the technique of Electron Channeling Contrast Imaging (ECCI) offers a direct visualization of crystalline defects such as dislocations in bulk specimens and especially in the GaN crystal as well as a way to classify their type. This work widens the scan area of this method from a few square micrometers to the wafer dimensions thanks to a fully automated scan process, achieving valuable statistics for fabrication improvement.

Proceedings - International Symposium for Testing and Failure AnalysisVol. 85212
Centre National de la Recherche Scientifique (FR), Infineon Technologies (Germany) (DE), Munich University of Applied Sciences (DE), IMEC (BE), Laboratoire d'Étude des Microstructures et de Mécanique des Matériaux (FR), Siemens (Austria) (AT), Infineon Technologies (Austria) (AT), HESAM Université (FR), Österreichisches Forschungsinstitut für Chemie und Technik (AT), Université de Lorraine (FR)
European Commission
Openalex Percentile: Top 82%
GaN-based semiconductor devices and materials
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