Process limitations of additive manufacturing for ceramic passive RF components

The digital freedom of additive manufacturing is a compelling option for the implementation of RF-components. Especially when having mm and sub-mm wave applications in mind, printable ceramic material systems are attractive due to their low-loss properties. A key factor for the suitability of ceramic additive manufacturing technology, however, is its resolution and precision. In the following work the current structure size achievable with LCM (Lithography-based Ceramic Manufacturing) technology is evaluated. Special focus is placed on Al<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf>O<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</inf> materials, as they are currently used in a multitude of THz and sub-THz applications.