Comprehensive analog signal processing platform enabled by acoustic charge transport in two-dimensional materials
Miniaturized, low-loss analog signal processing is crucial for next-generation wireless communication and sensing. Although two-dimensional acoustic charge transport (2D-ACT) devices integrating 2D field-effect transistors (FETs) with surface acoustic waves (SAWs) have substantial potential, previous work has been confined to dc operation, limiting real-time applications. Here, we present a hybrid platform that enables comprehensive dc and ac analog signal processing within a 2D-ACT device. By synergistically integrating 2D-FET and SAW components, our system achieves real-time subwavelength carrier monitoring and ac signal manipulation. ac measurements further elucidate mechanisms of dc acoustoelectric current generation. Notably, by controlling the phase and intensity of counter-propagating SAWs, we demonstrate analog signal addition and subtraction capabilities not previously realized in 2D-ACT devices. This platform establishes a benchmark for compact, low-loss ACT devices in ac signal processing, representing a notable advance for acoustoelectric technologies and 2D material systems.
Authors
- Siming Liu (ORCID: https://orcid.org/0000-0001-9004-1380)
- Jiefei Zhu (ORCID: https://orcid.org/0000-0003-3409-6744)
- Mansun Chan (ORCID: https://orcid.org/0000-0002-5104-7410)
- Dexing Liu (ORCID: https://orcid.org/0000-0001-5387-4981)
- Yanyan Luo (ORCID: https://orcid.org/0000-0003-0703-5946)
- Changjian Zhou (ORCID: https://orcid.org/0000-0002-7156-348X)
- Min Zhang (ORCID: https://orcid.org/0000-0002-2225-8024)
- Jiwei Chen (ORCID: https://orcid.org/0000-0003-4202-816X)
- Yihong Sun
- Cary Y. Yang (ORCID: https://orcid.org/0000-0002-3957-2191)
- Yueyi Sun
Institutions
- Santa Clara University (US)
- Hong Kong University of Science and Technology (HK)
- Peking University (CN)
- Chinese University of Hong Kong, Shenzhen (CN)
- Peking University Shenzhen Hospital (CN)
- University of Hong Kong (HK)
- South China University of Technology (CN)
Publication Details
- Journal
- Science Advances
- Published
- 2025-10-08
- DOI
- https://doi.org/10.1126/sciadv.ady7476
- Citations
- 1
- Primary Topic
- 2D Materials and Applications
- Type
- article
- Field-Weighted Citation Impact
- 0.52