Three-dimensional shrinking electronics on freestanding and freeform curvilinear surfaces

Wearable electronics that adapt to three-dimensional (3D) surfaces are essential for next-generation smart internet of things (IoT), yet existing strategies remain limited because of fabrication complexity, material incompatibility, or poor structural control. Here, this work introduces a scalable yet versatile approach to design and fabricate 3D electronic systems by printing liquid metal patterns onto heat-shrinkable polymer substrates. Upon controlled thermal actuation, the 2D circuits transform into target 3D geometries with enhanced electrical performance. The resulting 3D shrinking electronics enable conformal antenna integration for IoT devices and gesture-interactive wearable interfaces. This low-cost, versatile platform offers a paradigm for customizable, shape-adaptive electronics in intelligent real and virtual environments.

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Publication Details

Journal
Science Advances
Published
2025-10-08
DOI
https://doi.org/10.1126/sciadv.aea8051
Citations
2
Primary Topic
Advanced Sensor and Energy Harvesting Materials
Type
article
Field-Weighted Citation Impact
1.35
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article

Three-dimensional shrinking electronics on freestanding and freeform curvilinear surfaces

Abu Musa Abdullah, Feifei Shi, Yangbo Yuan, Ankan Dutta et al.
2 citations
Science Advances
Advanced Sensor and Energy Harvesting Materials
1.35
article

Three-dimensional shrinking electronics on freestanding and freeform curvilinear surfaces

Abu Musa Abdullah, Feifei Shi, Yangbo Yuan, Ankan Dutta, Huanyu Cheng, Xianzhe Zhang, Mohammad Ali Amidian, Bowen Li, Xin Xin, Dongliang Chen, Wanqing Zhang, Fatema Tuz Zohra, Jianyu Li
article en
2 citations

Abstract

Wearable electronics that adapt to three-dimensional (3D) surfaces are essential for next-generation smart internet of things (IoT), yet existing strategies remain limited because of fabrication complexity, material incompatibility, or poor structural control. Here, this work introduces a scalable yet versatile approach to design and fabricate 3D electronic systems by printing liquid metal patterns onto heat-shrinkable polymer substrates. Upon controlled thermal actuation, the 2D circuits transform into target 3D geometries with enhanced electrical performance. The resulting 3D shrinking electronics enable conformal antenna integration for IoT devices and gesture-interactive wearable interfaces. This low-cost, versatile platform offers a paradigm for customizable, shape-adaptive electronics in intelligent real and virtual environments.

Science AdvancesVol. 11(41)
Pennsylvania State University (US), Harrisburg University of Science and Technology (US), Pennsylvania Department of Agriculture (US), Drexel University (US)
Openalex Percentile: Top 17%
Advanced Sensor and Energy Harvesting Materials
1.35
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