Material removal mechanism based on scratched surface and abrasive chips in ultrasonic-assisted grinding of SiCp/Al composites

To thoroughly investigate the influence of ultrasonic vibration on the removal process and the removal mechanism, scratching experiments are conducted, and chip shape characteristics are examined. The application of ultrasonic vibration produces a protective shielding effect on the material’s surface cracks, thereby effectively reducing the risk of surface damage to the work piece. Additionally, the critical cutting depth in dynamic conditions can be increased, leading to enhanced plastic removal and reduced occurrence of surface fracture and fragmentation. The aluminum matrix interacts with the reinforcement particles, leading to their removal through plastic deformation. Moreover, certain portions of the substrate material undergo a phenomenon known as substrate coating. The elimination of SiC particles is achieved through the synergistic interaction between brittleness and plasticity, which arises from the continuous variation in the instantaneous cutting depth a p ( t ) of the abrasive on the tool within a specific amplitude range. This process involves phenomena such as particle displacement, detachment, and extraction.