Powder Bed Fabrication of Copper: A Comprehensive Literature Review

Powder bed fusion of copper has been extensively investigated using both laser-based (PBF-LB/M) and electron beam-based (PBF-EB/M) additive manufacturing technologies. Each technique offers unique benefits as well as specific limitations. Near-infrared (NIR) laser-based LPBF is widely accessible; however, the high reflectivity of copper limits energy absorption, thereby resulting in a narrow processing window. Although optimized parameters can yield relative densities above 97%, issues such as keyhole porosity, incomplete melting, and anisotropy remain concerns. Green lasers, with higher absorptivity in copper, offer broader process windows and enable more consistent fabrication of high-density parts with superior electrical conductivity, often reaching or exceeding 99% relative density and 100% International Annealed Copper Standard (IACS). Mechanical properties, including tensile and yield strength, are also improved, though challenges remain in surface finish and geometrical resolution. In contrast, Electron Beam Powder Bed Fusion (EB-PBF) uses high-energy electron beams in a vacuum, eliminating oxidation and leveraging copper’s high conductivity to achieve high energy absorption at lower volumetric energy densities (~80 J/mm3). This results in consistently high relative densities (>99.5%) and excellent electrical and thermal conductivity, with additional benefits including faster scanning speeds and in situ monitoring capabilities. However, EB-PBF processes in general face their own limitations, such as surface roughness and powder smoking. This paper provides a comprehensive review of the current state of laser-based (PBF-LB/M) and electron beam-based (PBF-EB/M) powder bed fusion processes for the additive manufacturing of copper, summarizing key trends, material properties, and process innovations. Both approaches continue to evolve, with ongoing research aimed at refining these technologies to enable the reliable and efficient additive manufacturing of high-performance copper components.