Investigation of SiO2 Cladding Application on Ta2O5 Films for Reduction of Delamination During Dicing

ABSTRACT Tantalum pentoxide () is of interest in photonics due to its optical properties, including high non‐linear refractive index and low optical propagation losses. Here we investigate mechanical dicing parameters, including depth of cut and material feed rate, to produce optical quality facets in a multilayered platform. films were deposited through sputtering onto a silicon substrate with a 6 thermal oxide. cladding layers were applied using different techniques: HELIOS sputtering, PECVD, and PECVD with TEOS. These were then diced using the same parameters and observed via optical microscope and SEM to determine the most effective cladding. The applied using HELIOS showed the best adhesion during dicing, with no chipping or delamination.

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Publication Details

Journal
Electronics Letters
Published
2025-01-01
DOI
https://doi.org/10.1049/ell2.70442
Primary Topic
Thin-Film Transistor Technologies
Type
article
Field-Weighted Citation Impact
0.00

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Investigation of SiO2 Cladding Application on Ta2O5 Films for Reduction of Delamination During Dicing

Corin B. E. Gawith, Martin D. B. Charlton, Glenn Churchill, James C. Gates et al.
Electronics Letters
Thin-Film Transistor Technologies
article

Investigation of SiO2 Cladding Application on Ta2O5 Films for Reduction of Delamination During Dicing

Corin B. E. Gawith, Martin D. B. Charlton, Glenn Churchill, James C. Gates, Paul C. Gow, Wenjie Wang
article en

Abstract

ABSTRACT Tantalum pentoxide () is of interest in photonics due to its optical properties, including high non‐linear refractive index and low optical propagation losses. Here we investigate mechanical dicing parameters, including depth of cut and material feed rate, to produce optical quality facets in a multilayered platform. films were deposited through sputtering onto a silicon substrate with a 6 thermal oxide. cladding layers were applied using different techniques: HELIOS sputtering, PECVD, and PECVD with TEOS. These were then diced using the same parameters and observed via optical microscope and SEM to determine the most effective cladding. The applied using HELIOS showed the best adhesion during dicing, with no chipping or delamination.

Electronics LettersVol. 61(1)
University of Southampton (GB)
Royal Academy of Engineering, Engineering and Physical Sciences Research Council
Openalex Percentile: Top 72%
Thin-Film Transistor Technologies
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