A Dual-Voltage 650 V and 100 V GaN Integrated Platform Featuring High-Performance Monolithic Components

This paper presents two integrated platforms developed by PH laboratory: a 650 V platform and a 100 V platform. Both platforms feature high-performance e-mode GaN HEMTs and a variety of passive components, including 2DEG resistors, metal resistors, p-GaN stack capacitors, M/2DEG capacitors, and MIM capacitors. The 650 V e-mode GaN HEMT demonstrates a V<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">TH</inf> of 1.3 V, an R<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ON</inf> of 10.8 Ω•mm, and a BV of 843 V, while the 100 V e-mode GaN HEMT exhibits a V<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">TH</inf> of 1 V, an R<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ON</inf> of 3.1 Ω•mm, and a BV of 174 V. Passive components are characterized: 2DEG resistors show a contact resistance of 0.38 Ω•mm (650 V) and 0.3 Ω•mm (100 V), with sheet resistances of 347.5 Ω/sq (650 V) and 403 Ω/sq (100 V). Metal resistors achieve a low sheet resistance of 17 Ω/sq, ideal for precision applications. The p-GaN stack capacitors reach maximum densities of 162 nF/cm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> (650 V) and 115 nF/cm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> (100 V), while MIM capacitors achieve 20 nF/cm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> (650 V) and 589.7 nF/cm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> (100 V), enabling significant area savings. These platforms offer superior performance and design flexibility, making it highly suitable for compact, high-power-density applications.

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Publication Details

Published
2025-08-15
DOI
https://doi.org/10.1109/wipda-asia63772.2025.11183708
Primary Topic
Silicon Carbide Semiconductor Technologies
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article
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article

A Dual-Voltage 650 V and 100 V GaN Integrated Platform Featuring High-Performance Monolithic Components

Chao Feng, Danfeng Mao, Yanlin Wu, Yuxi Wan et al.
Silicon Carbide Semiconductor Technologies
article

A Dual-Voltage 650 V and 100 V GaN Integrated Platform Featuring High-Performance Monolithic Components

Chao Feng, Danfeng Mao, Yanlin Wu, Yuxi Wan, Zuoheng Jiang, Junye Wu, Jiawei Chen, Keping Wu, David Zhou
article en

Abstract

This paper presents two integrated platforms developed by PH laboratory: a 650 V platform and a 100 V platform. Both platforms feature high-performance e-mode GaN HEMTs and a variety of passive components, including 2DEG resistors, metal resistors, p-GaN stack capacitors, M/2DEG capacitors, and MIM capacitors. The 650 V e-mode GaN HEMT demonstrates a V<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">TH</inf> of 1.3 V, an R<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ON</inf> of 10.8 Ω•mm, and a BV of 843 V, while the 100 V e-mode GaN HEMT exhibits a V<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">TH</inf> of 1 V, an R<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ON</inf> of 3.1 Ω•mm, and a BV of 174 V. Passive components are characterized: 2DEG resistors show a contact resistance of 0.38 Ω•mm (650 V) and 0.3 Ω•mm (100 V), with sheet resistances of 347.5 Ω/sq (650 V) and 403 Ω/sq (100 V). Metal resistors achieve a low sheet resistance of 17 Ω/sq, ideal for precision applications. The p-GaN stack capacitors reach maximum densities of 162 nF/cm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> (650 V) and 115 nF/cm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> (100 V), while MIM capacitors achieve 20 nF/cm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> (650 V) and 589.7 nF/cm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> (100 V), enabling significant area savings. These platforms offer superior performance and design flexibility, making it highly suitable for compact, high-power-density applications.

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Silicon Carbide Semiconductor Technologies
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