Study on SiC Power Module Cooling Technologies Suitable for High-Junction-Temperature and High-Power-Density Applications

The emergence of wide-bandgap semiconductors with superior performance has elevated expectations for the high-temperature operation and power density of power electronics systems, while simultaneously presenting more stringent challenges for cooling technologies related to system reliability and lifespan. This study, based on Multiphysics coupling simulation, reveals that conventional forced water cooling and forced air cooling are unable to meet the demands of high-temperature and high-power-density applications. Key principles for selecting related cooling technologies were summarized. Considering these principles and implementation challenges, forced oil cooling and water-based two-phase cooling technologies were selected. Simulation validation confirmed their appropriate coolant properties and heat dissipation effects. Additionally, this study addressed the challenge of simulating phase change processes in two-phase cooling by introducing an extended RPI model in the simulation.