Study on Cross-Scale Collaborative Control of Composite Properties for Power Device Packaging

Aiming at the deterioration of electrothermal properties of silicone gel, an h-BN doped silicone gel composite material was proposed in this paper. The h-BN/ silicon gel material preparation platform and the material electrical breakdown experimental platform were set up, and the thermal conductivity and insulation properties were co-optimized by adjusting the dispersion of the filler. The experimental results show that the introduction of h-BN significantly improves the thermal conductivity of the material, which reaches 0.329 W/(m·K) when doped with 30 wt%, which is 2.12 times that of the pure matrix. The thermal stability of the composite was further verified by thermogravimetric analysis. In terms of electrical properties, the breakdown field strength of 10 wt% doping reaches 28.62 kV/mm, which is 25% higher than that of pure silicon gel. At 30 wt% doping, the breakdown field strength decreased by 20% due to packing agglomeration. This study provides a new idea for improving the electro-thermal performance of packaging materials for new energy high frequency power devices.