Understanding the Role of Buffer Traps in GaN HEMTs: A Simulation Study on Dynamic R<sub>on</sub>

This work employs calibrated Technology Computer-Aided Design (TCAD) simulations to analyze buffer trap behavior under varying stress amplitude (V<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">stress</inf>) and duration (t<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">stress</inf>) conditions and its impact on dynamic onresistance (R<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</inf>) degradation. Two distinct degradation phases are identified: (I) a V<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">th</inf> -shift dominant phase; (II) a current collapse dominant phase without additional V<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">th</inf> shift. The two phases arise from the time-dependent, region-specific electron trapping within buffer layer during off-state drain stress. These findings provide insights into buffer trap dynamics and their impact on dynamic R<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</inf> degradation.

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Publication Details

Published
2025-08-15
DOI
https://doi.org/10.1109/wipda-asia63772.2025.11184046
Primary Topic
GaN-based semiconductor devices and materials
Type
article
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article

Understanding the Role of Buffer Traps in GaN HEMTs: A Simulation Study on Dynamic Ron

Mengqi Fan, Danfeng Mao, Yuxi Wan, Xinyue Dai et al.
GaN-based semiconductor devices and materials
article

Understanding the Role of Buffer Traps in GaN HEMTs: A Simulation Study on Dynamic Ron

Mengqi Fan, Danfeng Mao, Yuxi Wan, Xinyue Dai, Haiyang Li, Yan Wang, Xiaoping Wang, David Zhou
article en

Abstract

This work employs calibrated Technology Computer-Aided Design (TCAD) simulations to analyze buffer trap behavior under varying stress amplitude (V<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">stress</inf>) and duration (t<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">stress</inf>) conditions and its impact on dynamic onresistance (R<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</inf>) degradation. Two distinct degradation phases are identified: (I) a V<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">th</inf> -shift dominant phase; (II) a current collapse dominant phase without additional V<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">th</inf> shift. The two phases arise from the time-dependent, region-specific electron trapping within buffer layer during off-state drain stress. These findings provide insights into buffer trap dynamics and their impact on dynamic R<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</inf> degradation.

Tsinghua University (CN)
Openalex Percentile: Top 83%
GaN-based semiconductor devices and materials
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