Design of Short-Circuit and Overload Protection Chips for SiC MOSFETs

This paper proposes a fast short-circuit (SC) and overload (OL) protection integrated circuit (IC) for silicon carbide (SiC) metal-oxide-semiconductor field-effect transistors (MOSFETs). The method achieves short-circuit protection (SCP) by detecting the voltage drop across the inductance between the Kelvin source and power source of the SiC MOSFET, which is generated by the di/dt. OL protection is achieved by detecting the current and voltage of the SiC MOSFET, thereby accumulating energy for protection. The proposed protection IC is implemented using a 0.5 µm Bipolar-Cmos-DMOS (BCD) process, with a chip area of approximately 2 mm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup>. The effectiveness of SC and OL protection is validated on a 1200V/80mΩ SiC MOSFET test platform. Experimental results show that when a SC fault occurs in the SiC MOSFET, the chip can detect the fault and safely turn off the device in approximately 150 ns. Similarly, when an OL fault occurs, the chip can quickly detect the fault and shut down the device.

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Publication Details

Published
2025-08-15
DOI
https://doi.org/10.1109/wipda-asia63772.2025.11183918
Primary Topic
Silicon Carbide Semiconductor Technologies
Type
article
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article

Design of Short-Circuit and Overload Protection Chips for SiC MOSFETs

Jiahui Lv, Yuan Yang, Minmin Zhang
Silicon Carbide Semiconductor Technologies
article

Design of Short-Circuit and Overload Protection Chips for SiC MOSFETs

Jiahui Lv, Yuan Yang, Minmin Zhang
article en

Abstract

This paper proposes a fast short-circuit (SC) and overload (OL) protection integrated circuit (IC) for silicon carbide (SiC) metal-oxide-semiconductor field-effect transistors (MOSFETs). The method achieves short-circuit protection (SCP) by detecting the voltage drop across the inductance between the Kelvin source and power source of the SiC MOSFET, which is generated by the di/dt. OL protection is achieved by detecting the current and voltage of the SiC MOSFET, thereby accumulating energy for protection. The proposed protection IC is implemented using a 0.5 µm Bipolar-Cmos-DMOS (BCD) process, with a chip area of approximately 2 mm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup>. The effectiveness of SC and OL protection is validated on a 1200V/80mΩ SiC MOSFET test platform. Experimental results show that when a SC fault occurs in the SiC MOSFET, the chip can detect the fault and safely turn off the device in approximately 150 ns. Similarly, when an OL fault occurs, the chip can quickly detect the fault and shut down the device.

Xi'an University of Technology (CN)
Openalex Percentile: Top 73%
Silicon Carbide Semiconductor Technologies
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