A method for enhancing the heat dissipation performance of power devices through graphene Coating

With the trend of power devices towards higher power density and miniaturization, traditional cooling technologies face dual challenges in efficiency and cost. To address this issue, this paper proposes a graphene coating-based method to enhance radiative heat transfer in power devices. The effectiveness of graphene coating compared to conventional surface treatments was validated through finite element simulation. Comparative experiments were conducted using fabricated copper substrates with graphene coating and uncoated counterparts, where temperature distribution was monitored using thermal imaging and thermocouple measurements under 10A to 35A current loads. Experimental results demonstrate that at 35A operation, the graphene coating reduced the maximum substrate surface temperature by approximately 36°C (160°C without coating vs. 124°C with coating), while thermocouple measurements showed nearly 20°C reduction at substrate edges. Further analysis reveals that the cooling enhancement effect becomes particularly pronounced above 25A, showing significant temperature differentials. This study provides new insights for passive cooling design in high-power devices.