INFLUENCE OF TEMPERATURE ON MODE I FRACTURE TOUGHNESS OF A DUCTILE ADHESIVE
The main goal of this study is to quantify the effect of temperature on Mode I fracture toughness for a ductile adhesive. Later, this set of material parameters was used to simulate a Double Cantilever Beam (DCB) sample with various shapes of Traction-separation models to better capture the gradual failure of the adhesive under different thermal operating conditions.
Authors
- L Horák (ORCID: https://orcid.org/0009-0003-8975-2865)
- Jan Krystek (ORCID: https://orcid.org/0000-0002-2805-1542)
Publication Details
- Published
- 2025-01-01
- DOI
- https://doi.org/10.46793/41das2025.051h
- Primary Topic
- Metal Forming Simulation Techniques
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- Západočeská Univerzita v Plzni