Effect of additional dielectric layer and grounded shield on rf characteristics of GaAs microwave monolithic integrated circuit elements in 3D-integrated modules

The effect of coating GaAs monolithic integrated circuit with a benzocyclobutene dielectric layer and grounded copper shield is investigated. Using electromagnetic simulation up to 40 GHz, changes of RF characteristics of microstrip and coplanar transmission lines, a Marshand balun, and a bandpass filter due to coating are demonstrated. It is shown that from the performance variation viewpoint, the application of lines is preferred in GaAs monolithic integrated circuits used in 3D-integrated modules with such the coating.