Advanced Optimization and Empirical Study of Heat Sink Efficiency for Superior Heat Transfer

The present research explores the advanced methods to enhance the heat dissipation behaviour of a pin fin heat sink for electronic cooling. Commonly adopted designs do not provide sufficient cooling performance under high power load, and the interaction between fin structure/material/fans has not been well understood. In order to resolve this, five different heat sink models (Plate Fin Heat Sink – PFHS, Circular Pin Fin Heat Sink – CPFHS, Polar pin fin C condition gives the minimum value of thermal resistance and maximum values of Q for a change in heated mode) been performed with studies it is observed that PCMPFHS compared with remaining materials presents the lowest temperature rise. The results indicated that pin fin fins were more effective compared to plate heater sinks, with forced convection being the most favorable. Of the configurations tested, the perforated and PCM-augmented models featured promising scaling capacity for thermal performance. An optimization formulation was further created to trade thermal performance against cost and ease of manufacturing. These results can help guide the development of next-generation heat sinks for small, high-power electronics.