Enhanced thermal management and energy efficiency in electronic processor cooling using MWCNT-LA NEPCM heat sink with U-tube heat pipes

This study investigates the efficiency of a multi-walled carbon nanotube-infused lauric acid (MWCNT-LA) heatsink with U-tube heat pipes filled with n-pentane for electronic processor cooling. Experimental evaluations were conducted under varying heat loads and filling ratios to assess processor stability and energy efficiency. The investigation focused on energy savings, the thermal resistance of different heat pipe-assisted heatsink modules with multi-walled carbon nanotube-infused lauric acid phase change material, with its regeneration time, and optimal heat pipe filling ratio. Results showed that the MWCNT-LA heat sink module with 50% n-pentane filling performed best under higher heat loads, achieving the lowest thermal resistance of 0.63 °C/W at 50% filling ratio and 75% heat load. This design was 3.58 times more effective than the unfilled heat pipe version and achieved 78% energy savings with minimal cooling fan energy consumption. The developed heat sink design improves thermal management by utilizing latent heat storage and enhancing heat transport efficiency through the heat pipe, thus optimizing thermal performance, heat dissipation, and temperature regulation. These improvements increased the operational reliability and energy efficiency of processors in data center cooling applications. • Multi-walled carbon nanotubes embedded in lauric acid phase change material. • Nano-embedded phase change material-filled finned heat sink. • Nano-embedded phase change material heat sink increases operating time by 3.58 times. • Lower thermal resistance of 0.63 °C•W −1 at 50% filling ratio and 75% heat load. • Fifty percent is the optimum filling ratio for U-tube heat pipe.