Cooling analysis and innovative design to increase heat transfer in sealed electronic devices

One of the most important problems of electronic devices is heating. Especially high-performance processors and electronic cards can draw significant power and therefore reach critical temperatures. Heating can lead to functional loss or failure of devices. Sealed systems are used in many areas today. Sealing is defined as not allowing two substances, water and dust, into a closed space. The purpose of our thesis is to design a new cooling system related to the cooling of sealed electronic devices. External flow ventilation will be used as active cooling, and a heatsink structure will be used as passive cooling. Then, the efficiency of this new design will be analyzed using CFD method. By keeping the device at reasonable temperature values, a new design example will be created, especially for cooling sealed structures. Analysis studies have been conducted according to different ventilation channels. As a result of these studies, reference data on how much heat can be drawn by different fin structures will be obtained. These reference data are aimed to provide an approximate cooling capacity estimation in projects where sealing is required. The data obtained as a result of the study are compared and presented in tabular form.