Utilizing Silicone Gel Encapsulation in Power Semiconductor Module to Improve Manufacturability While Reducing Common-Mode Noise

The novel power module introduced in this paper features an etched section of the bottom copper layer of a direct-bonded copper substrate, encapsulated in silicone gel. The proposed design improves manufacturability and reduces common-mode (CM) electromagnetic interference, while it does not sacrifice size, thermal performance, and manufacturing process. The measured CM noise in prototype hardware was decreased by maximum 5 dBμV in steady-state operation. Thermal cycling tests with a total of 1000 cycles confirmed the proposed power module does not compromise mechanical stability.