Unraveling ionic switching dynamics in high-k dielectric double-gate transistors via low-frequency noise spectroscopy

High-k dielectric materials such as HfO<sub>2</sub> have garnered significant attention for their potential applications in advanced electronic devices due to their superior dielectric properties. Particularly, oxygen vacancies within these materials can be strategically utilized to implement memory functionalities. However, the precise analysis of the electrical, chemical, and electrochemical characteristics related to oxygen vacancies remains challenging. In this study, we fabricated a double-gate thin-film transistor (TFT) structure employing HfO<sub>2</sub> as the gate dielectric for both top and bottom gates, with the oxygen vacancy concentration intentionally modulated by introducing a TiO<sub>2</sub> interlayer at the bottom gate stack. This TiO<sub>2</sub> layer effectively increases the oxygen vacancy content within the bottom gate dielectric, facilitating oxygen vacancy migration-based memory operation primarily through the bottom gate. The resulting asymmetry between the top and bottom gates was systematically analyzed using low-frequency noise (LFN) characterization, elucidating for the first time the distinct impacts of oxygen vacancy modulation on device electrical behavior and operational mechanisms. This comprehensive LFN analysis provides critical insights into the fundamental dynamics of defect-mediated memory operation, highlighting the importance of dielectric engineering in optimizing next-generation oxide-based electronic devices.

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Publication Details

Journal
Nano Convergence
Published
2025-10-03
DOI
https://doi.org/10.1186/s40580-025-00512-2
Citations
1
Primary Topic
Semiconductor materials and devices
Type
article
Field-Weighted Citation Impact
0.73

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article

Unraveling ionic switching dynamics in high-k dielectric double-gate transistors via low-frequency noise spectroscopy

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Nano Convergence
Semiconductor materials and devices
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article

Unraveling ionic switching dynamics in high-k dielectric double-gate transistors via low-frequency noise spectroscopy

Wonjun Shin, Soi Jeong, Ryun‐Han Koo, Youngchan Cho, Been Kwak, Jangsaeng Kim, Changhyeon Han, Jong-Ho Lee, Daewoong Kwon
article en
1 citations

Abstract

High-k dielectric materials such as HfO<sub>2</sub> have garnered significant attention for their potential applications in advanced electronic devices due to their superior dielectric properties. Particularly, oxygen vacancies within these materials can be strategically utilized to implement memory functionalities. However, the precise analysis of the electrical, chemical, and electrochemical characteristics related to oxygen vacancies remains challenging. In this study, we fabricated a double-gate thin-film transistor (TFT) structure employing HfO<sub>2</sub> as the gate dielectric for both top and bottom gates, with the oxygen vacancy concentration intentionally modulated by introducing a TiO<sub>2</sub> interlayer at the bottom gate stack. This TiO<sub>2</sub> layer effectively increases the oxygen vacancy content within the bottom gate dielectric, facilitating oxygen vacancy migration-based memory operation primarily through the bottom gate. The resulting asymmetry between the top and bottom gates was systematically analyzed using low-frequency noise (LFN) characterization, elucidating for the first time the distinct impacts of oxygen vacancy modulation on device electrical behavior and operational mechanisms. This comprehensive LFN analysis provides critical insights into the fundamental dynamics of defect-mediated memory operation, highlighting the importance of dielectric engineering in optimizing next-generation oxide-based electronic devices.

Nano ConvergenceVol. 12(1)
Seoul National University (KR), Sogang University (KR), Hanyang University (KR), Sungkyunkwan University (KR)
National Research Foundation, National Research Foundation of Korea, Ministry of Science and ICT, South Korea, Institute for Information and Communications Technology Promotion
Openalex Percentile: Top 23%
Semiconductor materials and devices
0.73
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