Correction: Reliable fabrication of buried microchannels via polymer trench passivation
suggests should have read A negatively tapered (reentrant) profile could indeed help protect the sidewalls during the SF6 bias step.
Authors
- Anže Sitar (ORCID: https://orcid.org/0000-0003-2407-4437)
- Lorenza Ferrario (ORCID: https://orcid.org/0000-0003-0397-9384)
- A. Picciotto (ORCID: https://orcid.org/0000-0002-4089-9503)
- Alvise Bagolini (ORCID: https://orcid.org/0000-0002-1936-4002)
- Ali Nawaz (ORCID: https://orcid.org/0000-0002-6181-1398)
Institutions
- Fondazione Bruno Kessler (IT)
Publication Details
- Journal
- Microsystem Technologies
- Published
- 2025-10-03
- DOI
- https://doi.org/10.1007/s00542-025-05958-2
- Primary Topic
- Nanofabrication and Lithography Techniques
- Type
- article
- Field-Weighted Citation Impact
- 0.00