Buffering heat fluctuation of IGBT power electronic modules using phase change material-based thermal management for wind power generation

• PCM-based thermal management buffers the heat fluctuation of IGBT modules. • Heat fluctuation is buffered by 8.7 °C at most. • The buffering performance is the best where heat fluctuation is the largest. • Different types of PCM are examined and analysed. The insulated-gate bipolar transistor (IGBT) power electronic module is an essential component of the converter system for wind power generation. However, it suffers from the heat fluctuation induced by transient output power from the wind turbulence, which makes it vulnerable and easy to fail. In this study, we developed a phase change material (PCM)-based thermal management solution whose structure is simple and does not change the existing heat sinks. PCM absorbs most heat when the power loss surges, but its temperature stays stable owing to the solid-liquid phase transition. That reduces the peak junction temperature, and since the decrease in peak temperature is larger than that in the valley temperature, the heat fluctuation of chips is buffered. This solution decreases heat fluctuation by 8.7 °C at most and has the best buffering performance where heat fluctuation is largest. The melting fraction of PCM does not exceed 1 during the thermal management process, indicating that the PCM can work sustainably. Different types of PCM were examined, and the results indicate that PCM2’s melting fraction responds more sensitively to power loss and absorbs more power loss as the latent heat energy, thus has better buffering performance than PCM1. The lifetime of the IGBT module is also predicted and is extended significantly. The PCM-based thermal management solution developed in this study is a promising approach to improve the robustness and reduce the maintenance cost of the IGBT modules in wind power generation.