Manufacturing technology of passive elements of optoelectronic microwave boards with air bridges

In the standard technology of optoelectronic boards, discrete silicon or ceramic capacitors are widely used in signal filtering and separation circuits, the use of which is accompanied by the need to install wire jumpers by welding methods, which leads to a mismatch with the wave impedance of microstrip lines due to a violation of the planarity of the structure and partial reflection of the microwave signal. In order to eliminate these shortcomings, the laboratory of radiophotonics of the IAO SB RAS proposed a technology for manufacturing the passive part of optoelectronic boards with thin-film capacitors and air bridge connections manufactured using planar technology on a single substrate in one technological cycle using standard highly efficient methods of magnetron sputtering and galvanic deposition.