Through-holes vias ceramic microstrip board metal filling by electrochemical deposition

The world microelectronics market needs components for manufacturing microwave hybrid-monolithic integrated circuits based on 3D integration, advanced radar systems for microwave equipment, optoelectronic devices, electronic countermeasures, identification. This paper describes the developed technology for copper/gold filling through vias of dielectric microstrip boards. The developed technology will allow a qualitative change in the approach to developing the topology of microstrip boards, since they will have a new element - a through hole filled with copper/gold, which: will allow the boards to operate at higher power, will reduce the number of vias, will allow to do without end metallization, which will greatly simplify the process of board manufacturing. The project results consumers are power microelectronics enterprises, for whose products it is important to withstand high voltages of up to several kilovolts and huge currents of hundreds of amperes.