Research on Coplanrrity Defect Detection of Component Pins Based on Point Cloud Processing

In electronic assembly processes, poor soldering of IC components (QFP/SOP) is often caused by component quality issues. Traditionally, lead coplanarity defects of components are detected using prism-based platforms, which suffer from low efficiency and inconsistent results. This paper proposes a point cloud data based system for automated detection of lead coplanarity defects in leaded components without the need for preediting inspection programs or inputting component parameters. The system addresses challenges in detecting lead coplanarity defects during electronic assembly, improving detection accuracy, consistency, and solder joint reliability in electronic products.