Investigation of double patterning method with the usage of antispacer

In this paper we review double lithography method with the usage of antispacer, which allows to form structures of critical layers with sub-193i lithographic dimensions that go beyond the single extreme ultraviolet lithography limits. We present a set of key parameters affecting the process productivity and a method for optimizing the lithographic process.

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Publication Details

Journal
Микроэлектроника / Russian Microelectronics
Published
2025-01-01
DOI
https://doi.org/10.7868/s3034548025010017
Primary Topic
Metal Forming Simulation Techniques
Type
article
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article

Investigation of double patterning method with the usage of antispacer

E. D. Tikhonova
Микроэлектроника / Russian Microelectronics
Metal Forming Simulation Techniques
article

Investigation of double patterning method with the usage of antispacer

E. D. Tikhonova
article en

Abstract

In this paper we review double lithography method with the usage of antispacer, which allows to form structures of critical layers with sub-193i lithographic dimensions that go beyond the single extreme ultraviolet lithography limits. We present a set of key parameters affecting the process productivity and a method for optimizing the lithographic process.

Микроэлектроника / Russian MicroelectronicsVol. 54(1)
Openalex Percentile: Top 72%
Metal Forming Simulation Techniques
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Investigation of double patterning method with the usage of antispacer — E. D. Tikhonova · Микроэлектроника / Russian Microelectronics (2025) | TGRS Research Map | TGRS