Investigation of double patterning method with the usage of antispacer
In this paper we review double lithography method with the usage of antispacer, which allows to form structures of critical layers with sub-193i lithographic dimensions that go beyond the single extreme ultraviolet lithography limits. We present a set of key parameters affecting the process productivity and a method for optimizing the lithographic process.
Authors
- E. D. Tikhonova
Publication Details
- Journal
- Микроэлектроника / Russian Microelectronics
- Published
- 2025-01-01
- DOI
- https://doi.org/10.7868/s3034548025010017
- Primary Topic
- Metal Forming Simulation Techniques
- Type
- article
- Field-Weighted Citation Impact
- 0.00