Topographic, Thermal and Chemical Characterization of Oxidized Cu and Cu-Ag Thin Films

This study investigated the effects of silver doping, natural ageing, and thermal-induced oxidation on the surface chemistry, morphology, and thermal performance of copper thin films. Ag is used as a doping element in Cu because, in bulk materials it usually refines microstructures, leading to increased hardness and mechanical strength through mechanisms such as solid solution strengthening and twinning. In this work was also used due to its oxidation resistance. Thin films of pure and silver-doped copper (Cu_2Ag and Cu_4Ag) were deposited by RF magnetron sputtering and characterized as-deposited, naturally aged, at room temperature and humidity for one year, and thermally treated at 200 °C, in air. The characterization included X-ray photoelectron spectroscopy (XPS), Atomic Force microscopy (AFM), and thermal analysis, specifically thermal conductivity (λ), thermal diffusivity (α), and thermal capacity (ρ.Cp). Surface XPS analysis revealed changes in copper and silver oxidation states after natural aging and annealing. AFM revelead that the incorporation of silver and heat treatment altered the surface roughness and morphology. Thermal analysis found that for lower silver concentrations, the thermal conductivity increased, but aging and annealing had varying effects depending on the silver content. The Cu_4Ag film showed the best thermal stability after natural ageing. Overall, the results suggest that carefully controlled silver doping can enhance the thermal stability of copper thin films for applications where aging is a concern, such as microelectronics.