GaN/Si Hetero-Structure Integration of Complementary Logic Inverter for Power Conversion

The paper demonstrates a GaN/Si hetero-structure integration of complementary logic inverter for power conversion, combining a GaN n-channel high-electron-mobility transistor (HEMT) and a Si p-channel metal-oxide-semiconductor field-effect transistor (MOSFET). The implementation of high-uniformity GaN HEMT by hydrogen treatment technology. The results show that n-FET and p-FET with the matched threshold voltage (n/p ratio = 1.7/–2.1 V), drain output current (139/–26 mA/mm) and on-state resistance (15.6/43.7 Ω∙mm). The complementary inverter (CL) achieves rail-to-rail output, low static current and fast switching performance (5 MHz). Enabled by a GaN/Si gate driver and a GaN power device of 5.6 A, the design further demonstrates 48-V-to-4.8-V floating buck conversion at MHz-level. This GaN-Si complementary circuit integration overcomes the limitations of single-material solutions for high switching frequency and high-power applications, validating its potential for future monolithic integration in power electronics.

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Publication Details

Journal
IEEE Journal of the Electron Devices Society
Published
2025-01-01
DOI
https://doi.org/10.1109/jeds.2025.3615938
Primary Topic
Silicon Carbide Semiconductor Technologies
Type
article
Field-Weighted Citation Impact
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article

GaN/Si Hetero-Structure Integration of Complementary Logic Inverter for Power Conversion

Weisheng Wang, Yong Cai, Yingfei Sun, Zhongming Zeng et al.
IEEE Journal of the Electron Devices Society
Silicon Carbide Semiconductor Technologies
article

GaN/Si Hetero-Structure Integration of Complementary Logic Inverter for Power Conversion

Weisheng Wang, Yong Cai, Yingfei Sun, Zhongming Zeng, Jiakai Zhang, Jihong Ding, Wen Liu, Xiaodong Zhang, Ang Li, Yong Wang, Baoshun Zhang, Guohao Yu, Yunsong Xu, Kaixuan He
article en

Abstract

The paper demonstrates a GaN/Si hetero-structure integration of complementary logic inverter for power conversion, combining a GaN n-channel high-electron-mobility transistor (HEMT) and a Si p-channel metal-oxide-semiconductor field-effect transistor (MOSFET). The implementation of high-uniformity GaN HEMT by hydrogen treatment technology. The results show that n-FET and p-FET with the matched threshold voltage (n/p ratio = 1.7/–2.1 V), drain output current (139/–26 mA/mm) and on-state resistance (15.6/43.7 Ω∙mm). The complementary inverter (CL) achieves rail-to-rail output, low static current and fast switching performance (5 MHz). Enabled by a GaN/Si gate driver and a GaN power device of 5.6 A, the design further demonstrates 48-V-to-4.8-V floating buck conversion at MHz-level. This GaN-Si complementary circuit integration overcomes the limitations of single-material solutions for high switching frequency and high-power applications, validating its potential for future monolithic integration in power electronics.

IEEE Journal of the Electron Devices Society
Chinese Academy of Sciences (CN), Suzhou Institute of Nano-tech and Nano-bionics (CN), Xi’an Jiaotong-Liverpool University (CN)
Openalex Percentile: Top 73%
Silicon Carbide Semiconductor Technologies
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GaN/Si Hetero-Structure Integration of Complementary Logic Inverter for Power Conversion — Weisheng Wang, Yong Cai, et al. · IEEE Journal of the Electron Devices Society (2025) | TGRS Research Map | TGRS