Optimization of Surface Roughness in the Electrodeposition Process

Abstract This work explores advanced engineering optimization techniques for minimizing surface roughness in the electrodeposition process, focusing on reducing the difference between the maximum and minimum deposition heights over a selected time span. The study identifies major contributing variables as forward current, reverse current, forward time proportion. and solution conductivity and explores their impact on surface roughness. A mathematical model created in COMSOL Multiphysics is used to simulate a surface defect on a substrate during electrodeposition, evaluating the deposition height difference between the defect peak and the deposition plane. Taguchi analysis was used to create a Design of Experiments and identify the significance of the targeted variables. Per the Taguchi analysis, the most studied variables ranked in order of greatest influence of surface roughness are forward current, conductivity, reverse current, and forward time proportion. Assuming a linear relationship between the parameters and the height difference, an objective function was obtained and used to systemically identify the optimal process parameters to minimize the surface roughness of nickel electrodeposition. For a minimum Δy, maximum values of solution conductivity should be paired with minimum values of the forward current, reverse current, and a forward time proportion greater than 0.5. This research contributes to further evolving micromanufacturing processes by providing a framework and systemic approach to enhancing the electroplating process and, in turn, providing valuable insight for advancements in electronics manufacturing, automotive components, and biomedical devices.