Wet Etching for Narrow Spaces in Semiconductor Manufacturing

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Publication Details

Journal
Journal of The Surface Finishing Society of Japan
Published
2025-04-01
DOI
https://doi.org/10.4139/sfj.76.170
Primary Topic
Electronic Packaging and Soldering Technologies
Type
article
Field-Weighted Citation Impact
0.00
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article

Wet Etching for Narrow Spaces in Semiconductor Manufacturing

S. Miyagawa
Journal of The Surface Finishing Society of Japan
Electronic Packaging and Soldering Technologies
article

Wet Etching for Narrow Spaces in Semiconductor Manufacturing

S. Miyagawa
article en

Abstract

No abstract available for this paper.
Journal of The Surface Finishing Society of JapanVol. 76(4)
SCREEN (Japan) (JP)
Openalex Percentile: Top 74%
Electronic Packaging and Soldering Technologies
DOIOpen Access PDFOpenAlex
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Wet Etching for Narrow Spaces in Semiconductor Manufacturing — S. Miyagawa · Journal of The Surface Finishing Society of Japan (2025) | TGRS Research Map | TGRS