Analysis of Subsurface Damage Based on K9 Glass Grinding

During the grinding process of K9 glass, various forms of surface damage-such as indentations and pitting-as well as subsurface damage-including cracks and residual stress-are generated. This paper focuses on the planetary grinding method utilizing bonded abrasives for both process research and subsurface damage detection. It examines the timeliness of grinding duration and analyzes the effects of abrasive grain size and grinding pressure on surface quality. Building upon the principle of differential etching, an improved HF chemical etching method is proposed to establish a relationship model that correlates the depth of subsurface damage with abrasive grain size, applied pressure, and surface roughness.