Synthesis and Properties Study of Liquid Crystalline Epoxy Resin Containing Azomethine-Based Monomeric Mesogens

The epoxy monomer N,1-bis(4-(2-oxiranemethoxy)phenyl)methylamine (HBAP-EP) was synthesized through the Schiff base reaction and epichlorohydrin method, and the HBAP-EP monomer was cured using p-aminobenzene sulfonamide (SAA). Differential scanning calorimetry (DSC), X-ray diffraction (XRD), and polarizing optical microscopy (POM) demonstrated that the epoxy monomer exhibits reversible liquid crystal properties, and the liquid crystal fraction of the monomer can reach 14.4% after curing at 120 °C. The fracture toughness of the resin cured at 120 °C can reach 0.93 KJ·m<sup>-2</sup>, and its thermal conductivity is 0.3229 W·(m·K)<sup>-1</sup>, both of which are higher than those of ordinary epoxy resin.

Authors

Institutions

Publication Details

Journal
Polymers
Published
2025-09-29
DOI
https://doi.org/10.3390/polym17192632
Primary Topic
Epoxy Resin Curing Processes
Type
article
Field-Weighted Citation Impact
0.00

Funders

Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

Synthesis and Properties Study of Liquid Crystalline Epoxy Resin Containing Azomethine-Based Monomeric Mesogens

Zhenyu Ouyang, Junjie Huang, Hongmei Pan, Kemei Pei et al.
Polymers
Epoxy Resin Curing Processes
article

Synthesis and Properties Study of Liquid Crystalline Epoxy Resin Containing Azomethine-Based Monomeric Mesogens

Zhenyu Ouyang, Junjie Huang, Hongmei Pan, Kemei Pei, Duy Tran Khuong Le
article en

Abstract

The epoxy monomer N,1-bis(4-(2-oxiranemethoxy)phenyl)methylamine (HBAP-EP) was synthesized through the Schiff base reaction and epichlorohydrin method, and the HBAP-EP monomer was cured using p-aminobenzene sulfonamide (SAA). Differential scanning calorimetry (DSC), X-ray diffraction (XRD), and polarizing optical microscopy (POM) demonstrated that the epoxy monomer exhibits reversible liquid crystal properties, and the liquid crystal fraction of the monomer can reach 14.4% after curing at 120 °C. The fracture toughness of the resin cured at 120 °C can reach 0.93 KJ·m<sup>-2</sup>, and its thermal conductivity is 0.3229 W·(m·K)<sup>-1</sup>, both of which are higher than those of ordinary epoxy resin.

PolymersVol. 17(19)
Zhejiang Sci-Tech University (CN)
Zhejiang Sci-Tech University
Openalex Percentile: Top 72%
Epoxy Resin Curing Processes
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.