Interfacial Diffusion and Copper Alloy Layer Wear Mechanism in Cu-20Pb-5Sn/45 Steel Bimetallic Composites

Cu-20Pb-5Sn/45 steel bimetallic composites were prepared using the solid–liquid composite method. The interfacial microstructure, bonding strength, and wear performance were systematically characterized to elucidate the mechanisms governing the solid-solution interface and copper alloy layer wear behavior. The results reveal that mutual diffusion of Cu and Fe forms a metallurgically bonded α-(Cu,Ni)/α-Fe interface with a diffusion layer thickness of approximately 10.7 µm and an interfacial shear strength of 227.58 MPa. Under dry sliding conditions, the average coefficient of friction was 0.145, with a wear rate of 7.3665 × 10−6 mm3/(N·m). The α-(Cu,Ni) matrix was reinforced by hard Cu3P and Ni-rich phases, which resist frictional shear stresses, while dispersed Pb particles provide self-lubricating properties, while the solid-solution interface hindered dislocation propagation, reducing dislocation pile-up and ensuring stable frictional performance.