Fabrication of 4H-SiC Low Gain Avalanche Detectors (LGADs)

Low gain avalanche detectors (LGADs) offer high temporal resolution for high energy particle detection, which is critical for next generation experiments in hadron colliders. While silicon LGADs (Si-LGADs) have rapidly matured in the last decade, research into silicon carbide (SiC) LGADs has only recently begun. By accounting for fundamental differences in material properties and fabrication processes, we present a prototype device design and process flow for 4H-SiC LGADs with etch-based isolation. Critical steps of the process flow and their results are discussed, including plasma etching, passivation, and the formation of low resistivity contacts. Electrical characterization (I-V, C-V) shows sufficient depletion of the device structure to demonstrate low-gain charge carrier multiplication.

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Publication Details

Journal
Key engineering materials
Published
2025-09-12
DOI
https://doi.org/10.4028/p-0t5ifb
Primary Topic
Silicon Carbide Semiconductor Technologies
Type
article
Field-Weighted Citation Impact
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article

Fabrication of 4H-SiC Low Gain Avalanche Detectors (LGADs)

Spyridon Pavlidis, John F. Muth, S. Holland, Phillip Barletta et al.
Key engineering materials
Silicon Carbide Semiconductor Technologies
article

Fabrication of 4H-SiC Low Gain Avalanche Detectors (LGADs)

Spyridon Pavlidis, John F. Muth, S. Holland, Phillip Barletta, Yashas Satapathy, Ben J. Sekely, Tao Yang, S. A. Stucci, C. Haber, Greg Allion
article en

Abstract

Low gain avalanche detectors (LGADs) offer high temporal resolution for high energy particle detection, which is critical for next generation experiments in hadron colliders. While silicon LGADs (Si-LGADs) have rapidly matured in the last decade, research into silicon carbide (SiC) LGADs has only recently begun. By accounting for fundamental differences in material properties and fabrication processes, we present a prototype device design and process flow for 4H-SiC LGADs with etch-based isolation. Critical steps of the process flow and their results are discussed, including plasma etching, passivation, and the formation of low resistivity contacts. Electrical characterization (I-V, C-V) shows sufficient depletion of the device structure to demonstrate low-gain charge carrier multiplication.

Key engineering materialsVol. 1024
North Carolina State University (US), Lawrence Berkeley National Laboratory (US), Brookhaven National Laboratory (US)
Openalex Percentile: Top 74%
Silicon Carbide Semiconductor Technologies
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