Ultrabroadband plug-and-play photonic tensor core packaging with sub-dB loss

Photonic integrated circuits (PICs) enable high-bandwidth neuromorphic processors and low-decoherence quantum computing on chip-scale platforms, but robust, scalable optical packaging remains a major challenge. Efficient fiber-to-chip coupling is critical to minimize loss and maintain high optical bandwidth for photonic computing. We present a plug-and-play fiber-to-PIC solution using female multifiber termination push-on cables, with alignment counterparts additively fabricated on the chip via two-photon polymerization. We develop 3D out-of-plane couplers achieving -0.41-decibel peak transmission and broadband performance with losses below 0.55 decibels in the 1500-to 1600-nanometer range. Integration with the plug-and-play interface adds only 0.37 ± 0.12 decibels, yielding a record-low 0.78-decibel loss for passive out-of-plane packaging. Reproducibility is demonstrated by interfacing a 17-port photonic circuit for incoherent photonic computing, coupling the full 100-nanometer spectrum of a superluminescent LED to enable low-noise operation at 17.6 gigabaud. This passive, multiport, and reconfigurable approach delivers high performance, reliability, and versatility, advancing photonic packaging toward the scalability of electronic chip integration.

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Publication Details

Journal
Science Advances
Published
2025-09-26
DOI
https://doi.org/10.1126/sciadv.adz1883
Citations
1
Primary Topic
Neural Networks and Reservoir Computing
Type
article
Field-Weighted Citation Impact
2.48
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article

Ultrabroadband plug-and-play photonic tensor core packaging with sub-dB loss

Clara Vazquez‐Martel, Wolfram H. P. Pernice, Eva Blasco, Linus Krämer et al.
1 citations
Science Advances
Neural Networks and Reservoir Computing
2.48
article

Ultrabroadband plug-and-play photonic tensor core packaging with sub-dB loss

Clara Vazquez‐Martel, Wolfram H. P. Pernice, Eva Blasco, Linus Krämer, Frank Brückerhoff‐Plückelmann, E. G. Jung, Helge Gehring
article en
1 citations

Abstract

Photonic integrated circuits (PICs) enable high-bandwidth neuromorphic processors and low-decoherence quantum computing on chip-scale platforms, but robust, scalable optical packaging remains a major challenge. Efficient fiber-to-chip coupling is critical to minimize loss and maintain high optical bandwidth for photonic computing. We present a plug-and-play fiber-to-PIC solution using female multifiber termination push-on cables, with alignment counterparts additively fabricated on the chip via two-photon polymerization. We develop 3D out-of-plane couplers achieving -0.41-decibel peak transmission and broadband performance with losses below 0.55 decibels in the 1500-to 1600-nanometer range. Integration with the plug-and-play interface adds only 0.37 ± 0.12 decibels, yielding a record-low 0.78-decibel loss for passive out-of-plane packaging. Reproducibility is demonstrated by interfacing a 17-port photonic circuit for incoherent photonic computing, coupling the full 100-nanometer spectrum of a superluminescent LED to enable low-noise operation at 17.6 gigabaud. This passive, multiport, and reconfigurable approach delivers high performance, reliability, and versatility, advancing photonic packaging toward the scalability of electronic chip integration.

Science AdvancesVol. 11(39)
Heidelberg University (DE), University of Münster (DE), CeNTech (DE)
Openalex Percentile: Top 8%
Neural Networks and Reservoir Computing
2.48
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