Neuralace: manufacture, parylene-C coating, and mechanical properties

<i>Objective.</i>This study investigates the mechanical properties of the Neuralace, a novel ultra-thin, high-channel-count mesh-type subdural electrode array, to characterize its mechanical compatibility with neural tissue (i.e., the forces exerted onto the brain upon conformation) for chronic brain-computer interface (BCI) applications.<i>Approach.</i>A full-factorial design of experiments was used to assess the effects of geometrical variations, orientation, and polymeric encapsulation on the stiffness of silicon-based Neuralace structures. A custom low-force four-point bending setup was developed to measure flexural stiffness in a physiologically relevant displacement range.<i>Main results.</i>The stiffness values of Neuralace structures ranged from 2.99 N m<sup>-1</sup>to 7.21 N m<sup>-1</sup>, depending on the cell-wall thickness (CWT) of the lace, orientation, and parylene-C (PPXC) encapsulation. Orientation and CWT had the largest impact on the stiffness of the structures, while the effects of PPXC encapsulation were statistically significant but more subtle. The stiffest Neuralace configuration is expected to exert forces approximately 10-100 times lower than commercially available subdural implants would when conforming to the brain's topology (considering a 60 mm radius of the gyrus).<i>Significance.</i>Subdural electrode arrays have traditionally been used for epilepsy monitoring and surgical planning. These arrays are now transitioning from short-term implantation in epilepsy monitoring to long-term use in BCIs, which requires consideration of the foreign body response to ensure long-term durability and functionality. Biocompatibility challenges, such as fibrotic encapsulation and reactive astrogliosis, highlight the need for conformal subdural implant designs that minimize mechanical stress on neural tissue. This study establishes a rigorous and reproducible framework for mechanical characterization of conformable neural implants and demonstrates the feasibility of tuning design parameters to reduce implant-induced mechanical stress on cortical tissue. The results support future development of chronic BCI-compatible subdural electrodes with improved biocompatibility through mechanical design.

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Publication Details

Journal
Journal of Neural Engineering
Published
2025-09-26
DOI
https://doi.org/10.1088/1741-2552/ae0c39
Primary Topic
Neuroscience and Neural Engineering
Type
article
Field-Weighted Citation Impact
0.00
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article

Neuralace: manufacture, parylene-C coating, and mechanical properties

Lukas Selzer, Balaji Srikanthan, Kai Zoschke, J. Botero et al.
Journal of Neural Engineering
Neuroscience and Neural Engineering
article

Neuralace: manufacture, parylene-C coating, and mechanical properties

Lukas Selzer, Balaji Srikanthan, Kai Zoschke, J. Botero, Piotr Mackowiak, Nicholas Witham, Florian Solzbacher, Sandeep Negi, Scott Roberts
article en

Abstract

<i>Objective.</i>This study investigates the mechanical properties of the Neuralace, a novel ultra-thin, high-channel-count mesh-type subdural electrode array, to characterize its mechanical compatibility with neural tissue (i.e., the forces exerted onto the brain upon conformation) for chronic brain-computer interface (BCI) applications.<i>Approach.</i>A full-factorial design of experiments was used to assess the effects of geometrical variations, orientation, and polymeric encapsulation on the stiffness of silicon-based Neuralace structures. A custom low-force four-point bending setup was developed to measure flexural stiffness in a physiologically relevant displacement range.<i>Main results.</i>The stiffness values of Neuralace structures ranged from 2.99 N m<sup>-1</sup>to 7.21 N m<sup>-1</sup>, depending on the cell-wall thickness (CWT) of the lace, orientation, and parylene-C (PPXC) encapsulation. Orientation and CWT had the largest impact on the stiffness of the structures, while the effects of PPXC encapsulation were statistically significant but more subtle. The stiffest Neuralace configuration is expected to exert forces approximately 10-100 times lower than commercially available subdural implants would when conforming to the brain's topology (considering a 60 mm radius of the gyrus).<i>Significance.</i>Subdural electrode arrays have traditionally been used for epilepsy monitoring and surgical planning. These arrays are now transitioning from short-term implantation in epilepsy monitoring to long-term use in BCIs, which requires consideration of the foreign body response to ensure long-term durability and functionality. Biocompatibility challenges, such as fibrotic encapsulation and reactive astrogliosis, highlight the need for conformal subdural implant designs that minimize mechanical stress on neural tissue. This study establishes a rigorous and reproducible framework for mechanical characterization of conformable neural implants and demonstrates the feasibility of tuning design parameters to reduce implant-induced mechanical stress on cortical tissue. The results support future development of chronic BCI-compatible subdural electrodes with improved biocompatibility through mechanical design.

Journal of Neural EngineeringVol. 22(5)
University of Utah (US), Blackrock Microsystems (United States) (US), Fraunhofer Institute for Reliability and Microintegration (DE)
Openalex Percentile: Top 71%
Neuroscience and Neural Engineering
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