Time-Interleaved SAR ADC in 22 nm Fully Depleted SOI CMOS

This work presents the design and simulation of a time-interleaved successive approximation register (SAR) analog-to-digital converter (ADC) implemented in GlobalFoundries’ 22 nm Fully Depleted Silicon-on-Insulator (FD-SOI) CMOS process. Motivated by the increasing demand for high-speed electrical links in data center and AI/ML applications, the proposed ADC architecture targets medium-resolution, high-throughput conversion with optimized power and area efficiency. The design leverages asynchronous SAR operation, bootstrapped sampling switches, and a hybrid binary/non-binary capacitive digital-to-analog converter (DAC) to achieve robust performance across process, voltage, and temperature (PVT) variations. System-level modeling using channel operating margin (COM) methodology guided the specification of key circuit blocks, enabling efficient trade-offs between resolution, speed, and power. Post-layout simulations demonstrated effective number of bits (ENOB) performance consistent with system requirements, while Monte Carlo analysis confirmed the statistical yield. The converter achieved competitive figures of merit compared to state-of-the-art designs, as benchmarked against the Murmann ADC survey. This work highlights critical design considerations for scalable mixed-signal architectures in advanced CMOS nodes and lays the foundation for future integration in high-speed SerDes systems.