Skew Characterization Analysis in CCL Fabrication

High speed digital (HSD) system is essential in modern communication as Artificial Intelligence (AI) grows at remarkably speed. Printed-Circuit-Board (PCB) is the bedrock of all complex high speed digital system, and Copper-CladLaminate (CCL) as a whole provides the critical materials to construct the entire PCB industry. SI has many metrics, and skew is one of the key factors. Poor skew could be catastrophic in the whole system performance. At the very beginning, taking the glass-weave-effect in CCL into account can mitigate skew effect. Different kinds of fabric, such as 2116, 1067 and 1037 with variant positions of transmission lines produce distinct skew. This heuristic approach is consistent with the experimental data.

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Publication Details

Published
2025-08-18
DOI
https://doi.org/10.1109/emcsipi52291.2025.11170256
Primary Topic
Electronic Packaging and Soldering Technologies
Type
article
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article

Skew Characterization Analysis in CCL Fabrication

ChaoHui Kuo, Chang-Chih Liu, Keh-Ping Chao
Electronic Packaging and Soldering Technologies
article

Skew Characterization Analysis in CCL Fabrication

ChaoHui Kuo, Chang-Chih Liu, Keh-Ping Chao
article en

Abstract

High speed digital (HSD) system is essential in modern communication as Artificial Intelligence (AI) grows at remarkably speed. Printed-Circuit-Board (PCB) is the bedrock of all complex high speed digital system, and Copper-CladLaminate (CCL) as a whole provides the critical materials to construct the entire PCB industry. SI has many metrics, and skew is one of the key factors. Poor skew could be catastrophic in the whole system performance. At the very beginning, taking the glass-weave-effect in CCL into account can mitigate skew effect. Different kinds of fabric, such as 2116, 1067 and 1037 with variant positions of transmission lines produce distinct skew. This heuristic approach is consistent with the experimental data.

Richtek Technology (Taiwan) (TW)
Openalex Percentile: Top 74%
Electronic Packaging and Soldering Technologies
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