Observation of Quasi-Saturation Phenomenon in Sidewall Gate GaN Vertical Transistors

We report the observation of quasi-saturation behavior in GaN vertical metal oxide semiconductor field-effect transistors featuring a sidewall-gate architecture. Compared to conventional trench-gate designs, the sidewall-gate structure exhibits pronounced drain current roll-off and negative transconductance under high gate bias. This degradation is consistent with space charge modulation, wherein localized electron accumulation at the gate-drift interface distorts the electric field distribution and limits carrier mobility. Comprehensive electrical characterization and technology computer-aided design simulations reveal how asymmetric gate geometry affects vertical and lateral electron spreading paths. These findings highlight the role for mitigating field-induced current degradation in vertical GaN power devices.

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Publication Details

Journal
ACS Applied Electronic Materials
Published
2025-09-25
DOI
https://doi.org/10.1021/acsaelm.5c01412
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
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article

Observation of Quasi-Saturation Phenomenon in Sidewall Gate GaN Vertical Transistors

Tien-Yu Wang, Wei‐Chih Lai, T.-Y. Wang, Jian‐Jang Huang et al.
ACS Applied Electronic Materials
GaN-based semiconductor devices and materials
article

Observation of Quasi-Saturation Phenomenon in Sidewall Gate GaN Vertical Transistors

Tien-Yu Wang, Wei‐Chih Lai, T.-Y. Wang, Jian‐Jang Huang, Ting-Ci Li, Junxiang Wang, Zhi-Xiang Zhang, C.C. Chang, Yu-Chuan Chu, Miin-Jang Chen
article en

Abstract

We report the observation of quasi-saturation behavior in GaN vertical metal oxide semiconductor field-effect transistors featuring a sidewall-gate architecture. Compared to conventional trench-gate designs, the sidewall-gate structure exhibits pronounced drain current roll-off and negative transconductance under high gate bias. This degradation is consistent with space charge modulation, wherein localized electron accumulation at the gate-drift interface distorts the electric field distribution and limits carrier mobility. Comprehensive electrical characterization and technology computer-aided design simulations reveal how asymmetric gate geometry affects vertical and lateral electron spreading paths. These findings highlight the role for mitigating field-induced current degradation in vertical GaN power devices.

ACS Applied Electronic MaterialsVol. 7(19)
National Taiwan University (TW), National Cheng Kung University (TW)
Openalex Percentile: Top 84%
GaN-based semiconductor devices and materials
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