A Novel Decoupling Structure Using Vias in Dielectric Block for 5G Dual-Band Dual-Polarized Antenna Array

A novel decoupling structure is proposed to improve the mutual couplings for dual-band dual-polarized antenna array. The structure consists of two kind of dielectric materials with different permittivity nested inside and outside, and driving four metallic vias into the outer layer dielectric block. A 1 × 4 dual-band dual-polarized antenna array loading with the proposed decoupling structure is further developed and simulated. The simulated results show that an isolation level of over 20 dB can be achieved for low-band and over 25 dB for high-band. The radiation patterns of the decoupled array are still acceptable for 5G communication systems. The proposed scheme has potential application prospects in massive multiple-input-multiple-output.